Flip Chip Die Bonder
Germany · Darmstadt
What the buyer is looking for
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Description as published (DE).
Contract
BuyerFAIR - Facility for Antiproton and Ion Research in Europe GmbH
TypeSupplies
Estimated valuevalue not published
Published24 August 2026
CategoryLaboratory & optical equipment · CPV 38000000
Who has won here before
| Company | Awards | Period |
|---|---|---|
| T.E.E.S. srl | 9 | 2022–2025 |
| ILK Dresden · Dresden | 8 | 2025–2026 |
| SAES RIAL Vacuum S.r.l. | 7 | 2023–2025 |
| Cryo Diffusion | 6 | 2025 |
| Fantini Sud S.p.A. · Anagni | 6 | 2023–2025 |
From 13.7M documented awards · regular winners know this buyer's requirements — that is your competition.
How often this buyer tenders this
20229
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202410
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20266
Who knows the rhythm prepares instead of reacting.
28
days until the deadline — Tuesday 22 September at 00:00
How to bid
Read the full notice — Original + documents
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