Flip Chip Die Bonder
Germany · Darmstadt
What the buyer is looking for
The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
Description as published (DE).
Contract
BuyerFAIR - Facility for Antiproton and Ion Research in Europe GmbH
TypeSupplies
Estimated valuevalue not published
Published21 August 2026
CategoryLaboratory & optical equipment · CPV 38000000
Who has won here before
| Company | Awards | Period |
|---|---|---|
| T.E.E.S. srl | 9 | 2022–2025 |
| ILK Dresden · Dresden | 8 | 2025–2026 |
| SAES RIAL Vacuum S.r.l. | 7 | 2023–2025 |
| Cryo Diffusion | 6 | 2025 |
| Fantini Sud S.p.A. · Anagni | 6 | 2023–2025 |
From 13.7M documented awards · regular winners know this buyer's requirements — that is your competition.
How often this buyer tenders this
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Who knows the rhythm prepares instead of reacting.
27
days until the deadline — Tuesday 22 September at 10:00
How to bid
Read the full notice — Original + documents
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