Supply Through Framework Agreement of Hotmelt Smart Card Chip Bond Tape (According to DRM 45118030) Ref.: PA/AM/1504/TJ/2026/SP427257
Suministro Mediante Acuerdo Marco de Cinta Hotmelt Smart Card Chip Bond (Según DRM 45118030)
 Ref.: PA/AM/1504/TJ/2026/SP427257
Spain · Madrid
Contract
BuyerFábrica Nacional de Moneda y Timbre - Real Casa de la Moneda
TypeSupplies
Estimated value154.000 €
Published25 August 2026
CategoryChemical products · CPV 24900000
Who has won here before
| Company | Awards | Period |
|---|---|---|
| ANSABIT SERVICIOS INFORMÁTICOS, S.L. · Madrid | 6 | 2019–2025 |
| CLICK COIN S.L. | 6 | 2023–2026 |
| LAMINADOS DE CARTON,S.L. · Pinto | 6 | 2023–2024 |
| EUROCEBRIAN SL · POBLA DE VALLBONA (LA) | 6 | 2022–2026 |
| PUBLIEQUIPO SL | 5 | 2023–2026 |
From 13.7M documented awards · regular winners know this buyer's requirements — that is your competition.
How often this buyer tenders this
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Who knows the rhythm prepares instead of reacting.
23
days until the deadline — Friday 18 September at 11:30
How to bid
Open PLACSP — Plataforma de Contratación del Sector Público and search there for:
Suministro Mediante Acuerdo Marco de Cinta Hotmelt Smart Card Chip Bond (Según DRM 45118030)
Ref.: PA/AM/1504/TJ/2026/SP427257We hold no notice number for this source — search by title or buyer.
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