Supply of equipment for separating semiconductor substrates into structures using laser cutting method
Dostawa urządzenia do separacji podłoży półprzewodnikowych na struktury metodą cięcia laserem
Poland · Warszawa
What the buyer is looking for
Przedmiotem zamówienia jest dostawa urządzenia do separacji podłoży półprzewodnikowych na struktury metodą cięcia laserem.
Description as published (DE).
Contract
BuyerCentrum Zaawansowanych Materiałów i Technologii CEZAMAT Politechniki Warszawskiej
TypeSupplies
Estimated valuevalue not published
Published27 August 2026
CategoryLaboratory & optical equipment · CPV 38500000
Who has won here before
| Company | Awards | Period |
|---|---|---|
| Technolutions Sp. z o.o. | 5 | 2024–2025 |
| AM Technologies Sp. z o.o. sp.k. | 2 | 2025 |
| ficonTEC Service GmbH · Achim | 2 | 2025 |
| Integrators Paweł Kulawiak | 2 | 2025 |
| Interlab Sp. z o.o. | 2 | 2025 |
From 13.7M documented awards · regular winners know this buyer's requirements — that is your competition.
How often this buyer tenders this
202421
202542
20262
Who knows the rhythm prepares instead of reacting.
32
days until the deadline — Tuesday 29 September at 00:00
How to bid
Read the full notice — Original + documents
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